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nepes

nepes

서울시, 서초구, south korea

82-2-3470-2700

About

Nepes corporation, founded in 1990, has been providing bumping and wafer-level package OSAT manufacturing services in partnership with Fabless and IDM customers worldwide since 2001. Nepes provides turn-key solution of IC back-end service for 8″ and 12″ wafer with reliable quality by implementing mainstream technology from the wafer bumping, IC packaging and testing. The Company’s portfolio of products covers Wafer level package(WLP), System in package(SiP) and Fan-out panel level package(FOPLP). Nepes has manufacturing sites in South Korea, Philippines and China and international sales offices in San Diego, CA, Shanghai, China and Taiwan.

Company Details

HQ Location

서울시, 서초구, south korea

Industry

semiconductor manufacturing

Employees

200

Specialties

Founded

1990

서울시

서울시 서초구 남부순환로 2415, 서울시, south korea

샌디에이고

9605 Scranton Rd, 샌디에이고, united states

괴산

충청북도 괴산군 청안면 네패스로 30, 괴산, south korea

음성

충청북도 음성군 삼성면 금일로 965번길 105, 음성, south korea

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